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Why icweb
icweb is committed to providing customers with professional, high-quality and fast PCB assembly turnkey solution. From WLCSP & flip-chip to the smallest passive and oddly-shaped components, high density assembly, low voiding soldering, proper underfll, edge bonding - including PCB protection with nano coating and conformal coating - and understanding materials impact on signal integrity, we can help you apply the latest technologies and techniques for flawless assembly and maximum performance.
Turnkey
PCB Manufacturing, components sourcing and
in-house assembly, whole project
management available at icweb.
Quick-turn Prototyping
Support from 1 to 300 pcs quantities, enable you
to go from design to function prototype faster
and with confidence.
On-Demand Fabrication
Agile fabrication process meets demand,
Experienced Team offers fantastic experience.
Strong Supply Chain Management
Deep cooperation with 3000+
original electronic components manufacturers and
their authorized agents and distributors.
Smart BOM System
Intelligently recognizing ,analyzing, matching,
comparing and recommending for your non-
template BOM list by uploading without
registration.
Overall Cost Reduction
Eliminate intermediate brokers,Reduce costs by
15%-45%, Improve purchase and production
efficiency.
Equipment and Capacity
Board Size
  • Minimum board size: 50mm x 50mm;
  • Maximum board size: 400mm x 550mm & 1200mm x 260mm.
Soldering Type
  • Provides PCBA soldering services for surface mount (SMT), post-in-plug (THT) or both.
PCB Board Type
  • PCB board (FR-4, metal substrate), PCB flexible board (FPC), Rigid-flex PCB.
PCB Stencil
  • Laser stencils are used to ensure that components such as small-pitch ICs and BGAs meet IPC-2 Class or higher standards.
Component Size
  • High-precision IC such as BGA: with a pitch of Min 0.25mm;
  • Passive components: we accept components as small as 01005 (EIA inch code).
Component Packaging
  • For SMT components, we accept reels, cut tapes, tubes and pallets package;
  • THT components in bulk is also accepted.
Quality Control
  • IQC: incoming inspection;
  • IPQC: in-production inspection;
  • Visual QC: routine quality inspection;
  • AOI: Check solder paste, soldering effect of SMD components, few parts or component polarity;
  • X-Ray: Check BGA, QFN and other high-precision hidden PAD components;
  • Functional testing: According to the customer's testing procedures and steps, the function and performance are tested to ensure compliance with the requirements;
  • Burn-in test: Test function and performance according to customer's test procedures and procedures to ensure compliance with requirements.
Processing Equipment
Loader
1. Board time: 6s/pcs
2. Step interval: 10/20/30/40 mm
3. PCB size: W250*L330mm(Max) W50*L50mm(Min)
Printer
1. Printing cycle: 13s/pcs
2. Accuracy: ±0.025mm
3. PCB size: W310*L400mm(Max) W50*L50mm(Min)
High-speed SMT
1. Component size: 01005-2220 (EIA inch code)
2. Speed: 42000 cph
3. Accuracy: ±40μm
4. PCB size: W300*L510mm(Max) W50*L50mm(Min)
Multifunctional SMT
1. Component size: 0402-150*25*30 (diagonal 152mm)
2. Speed: 18000 cph
3. Accuracy: ±30μm
4. PCB size: W300*L510(Max) W50*L50mm(Min)
Reflow soldering
1. Temperature zone configuration: 10 temperature zones, 20 heating modules
2. Temperature control accuracy: ±1℃
3. PCB width: Min50mm-Max300mm (simultaneously) Min50mm-Max550mm (single rail)
Optical detector
1. Camera resolution: 15μm
2. PCB size: W330*L480(Max) W25*L25mm(Min)
Plug-in line
1. Number of workstations: 8
2. PCB width: 50mm-350mm
Wave soldering
1. Chain speed: 500-1800mm/min
2. Temperature control accuracy: ±2°C
3. Temperature control
accuracy: ±2°C 4. Substrate width: 50mm-350mm
Wire and assembly line
1. Number of workstations: 10
2. The transmission speed is adjustable

+852-34210530

9:30 am - 12 am, 1:30 pm - 10 pm
Monday - Friday, UTC+8

ruihuangzh@163.com

Skype:
ruihuangzh@163.com
Email:
ruihuangzh@163.com
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